Invention Grant
- Patent Title: Heat sink assembly and method of utilizing a heat sink assembly
- Patent Title (中): 散热器组件和利用散热器组件的方法
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Application No.: US14482533Application Date: 2014-09-10
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Publication No.: US09326424B2Publication Date: 2016-04-26
- Inventor: Joonyoung Park , Haejoo Lee , Jihyun Park , Kiyoung Lee , Junseo Lee
- Applicant: OpenTV, Inc.
- Applicant Address: US CA San Francisco
- Assignee: OpenTV, Inc.
- Current Assignee: OpenTV, Inc.
- Current Assignee Address: US CA San Francisco
- Agency: Lowenstein Sandler LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02
Abstract:
A heat sink assembly and a method of utilizing a heat sink assembly where the heat sink assembly is configured to dissipate air from the bottom of the heat sink assembly to the top of the heat sink assembly utilizing a plurality of vents to cool a desired electrical component.
Public/Granted literature
- US20160073551A1 HEAT SINK ASSEMBLY AND METHOD OF UTILIZING A HEAT SINK ASSEMBLY Public/Granted day:2016-03-10
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