Invention Grant
- Patent Title: Web substrate having optimized emboss design
- Patent Title (中): 网板具有优化的压花设计
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Application No.: US14269563Application Date: 2014-05-05
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Publication No.: US09326646B2Publication Date: 2016-05-03
- Inventor: André Mellin , Kevin Benson McNeil , Thomas Timothy Byrne , Jason Merrill Jones
- Applicant: The Procter & Gamble Company
- Applicant Address: US OH Cincinnati
- Assignee: The Procter & Gamble Company
- Current Assignee: The Procter & Gamble Company
- Current Assignee Address: US OH Cincinnati
- Agent Peter D. Meyer
- Main IPC: D21H11/00
- IPC: D21H11/00 ; A47K10/16 ; B31F1/07 ; D21H27/02 ; D21H27/00 ; D21H27/40
Abstract:
A fibrous structure having a total dry tensile strength of greater than about 59 g/cm and at least one embossed ply having a surface thereof is disclosed. The surface has a surface area comprising from about 10.0 percent to about 20.0 percent line embossments. Also, a fibrous structure having at least two plies is disclosed. One of the two plies has a total dry tensile strength of greater than about 59 g/cm and at least one embossed ply having a surface thereof. The surface has a surface area comprising from about 10.0 percent to about 20.0 percent line embossments.
Public/Granted literature
- US20140242340A1 WEB SUBSTRATE HAVING OPTIMIZED EMBOSS DESIGN Public/Granted day:2014-08-28
Information query
