Invention Grant
US09326774B2 Device for implantation of medical devices 有权
医疗器械植入装置

  • Patent Title: Device for implantation of medical devices
  • Patent Title (中): 医疗器械植入装置
  • Application No.: US13565859
    Application Date: 2012-08-03
  • Publication No.: US09326774B2
    Publication Date: 2016-05-03
  • Inventor: Alan Eskuri
  • Applicant: Alan Eskuri
  • Applicant Address: US MA Mansfield
  • Assignee: Covidien LP
  • Current Assignee: Covidien LP
  • Current Assignee Address: US MA Mansfield
  • Agent Mark J. Kertz, Esq.
  • Main IPC: A61F2/06
  • IPC: A61F2/06 A61B17/12
Device for implantation of medical devices
Abstract:
An apparatus for implanting a medical device is provided that can be severed by electrolysis from a delivery member positioned in a patient. The apparatus can include an electrolytically detachable component that interconnects the medical device and the delivery member. The detachable component can have at least one corrodible first portion being adapted to serve as an anode in electrolytic corrosion. The at least one first portion can define a body having an outer surface and at least one surface structure extending inwardly from the outer surface into the body. The first portion can be electrolytically corrodible when in contact with a body fluid such that the medical device may be severed by electrolysis.
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