Invention Grant
- Patent Title: Solder piece, chip solder and method of fabricating solder piece
- Patent Title (中): 焊片，芯片焊料和制造焊料的方法
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Application No.: US14598007Application Date: 2015-01-15
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Publication No.: US09327364B2Publication Date: 2016-05-03
- Inventor: Masahiko Abe , Koji Watanabe , Hideaki Takahashi , Masahiko Kanno , Masaya Ito
- Applicant: Senju Metal Industry Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Senju Metal Industry Co., Ltd.
- Current Assignee: Senju Metal Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chernoff, Vilhauer, McClung & Stenzel, LLP
- Main IPC: B23K35/00
- IPC: B23K35/00 ; B23K35/02 ; B23K35/14 ; B23K35/30 ; B23K35/26 ; B23K35/28 ; B23K35/32 ; B23K35/40 ; B23K1/00 ; B23K1/008 ; B23K3/06 ; H05K3/34 ; B26F1/02
Abstract:
A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.
Public/Granted literature
- US20150122874A1 SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE Public/Granted day:2015-05-07
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