Invention Grant
- Patent Title: Nozzle plate, liquid ejecting head, and liquid ejecting apparatus
- Patent Title (中): 喷嘴板，液体喷射头和液体喷射装置
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Application No.: US14141110Application Date: 2013-12-26
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Publication No.: US09327500B2Publication Date: 2016-05-03
- Inventor: Satoshi Nagatoya , Nobuhiro Naito , Kosuke Wakamatsu , Michiya Nakamura
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2012-284496 20121227
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16
Abstract:
A silicon nozzle plate has excellent liquid resistance on an inner surface of a nozzle opening and a discharge surface. A plurality of the nozzle openings are disposed in a silicon substrate of the nozzle plate. A tantalum oxide film formed by atomic layer deposition is disposed on both surfaces of the silicon substrate and the inner surface of the nozzle opening.
Public/Granted literature
- US20140183284A1 NOZZLE PLATE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS Public/Granted day:2014-07-03
Information query
IPC分类:
