Invention Grant
- Patent Title: Liquid-accommodating-body accommodating receptacle, liquid supply apparatus, and liquid ejecting apparatus
- Patent Title (中): 液体容纳体容纳容器，液体供给装置和液体喷射装置
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Application No.: US14697076Application Date: 2015-04-27
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Publication No.: US09327506B2Publication Date: 2016-05-03
- Inventor: Yasunori Koike , Hiroyuki Yoda
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Stroock & Stroock & Lavan LLP
- Priority: JP2013-046034 20130307
- Main IPC: B41J2/175
- IPC: B41J2/175
Abstract:
A case includes a main receptacle body that accommodates an ink accommodating body which accommodates ink. A first tube support portion and second to fourth tube support portions that guide connection tubes that are connected to the ink accommodating bodies, respectively, are provided on an internal surface of the main receptacle body.
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Information query
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