Disclosed is a tamper resistant blister pack having a paperboard assembly attached to, and surrounding, at least a part of a flange on the blister (window element). An upper ply of the assembly is attached to an upper side of the flange. Additionally, although in some instances not necessary, a lower ply is attached to the lower side of the flange. The plies of the assembly have a paperboard layer, an upper film layer laminated to an upper side of the paperboard layer and a lower film layer laminated to a lower side of the paperboard layer. These layers and their attachment to the blister provide tear resistance without crisscrossing film orientation. Methods of making the pack are also disclosed.