An encapsulation structure comprising at least: a hermetically sealed cavity in which a micro-device is encapsulated, a substrate of which one face delimits one side of the cavity, at least two trenches formed through said face of the substrate, the interior volumes of each of the trenches communicating together, first portions of getter material covering at least in part side walls of the trenches without entirely filling the trenches, and completely covering the trenches at said face of the substrate, an opening formed through one of the first portions of getter material or through the substrate and making the interior volumes of the trenches communicate with an interior volume of the cavity.