Invention Grant
- Patent Title: Method of making electrically conductive micro-wires
- Patent Title (中): 制造导电微丝的方法
-
Application No.: US13757913Application Date: 2013-02-04
-
Publication No.: US09328253B2Publication Date: 2016-05-03
- Inventor: Yongcai Wang , Paul Matthew Hoderlein , John Andrew Lebens , Hwei-Ling Yau , David Paul Trauernicht
- Applicant: Yongcai Wang , Paul Matthew Hoderlein , John Andrew Lebens , Hwei-Ling Yau , David Paul Trauernicht
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent Raymond L. Owens; Kevin E. Spaulding
- Main IPC: H05K3/02
- IPC: H05K3/02 ; C09D11/52 ; H05K1/09 ; H05K3/12 ; C09D11/322
Abstract:
A method of making a conductive article includes providing a substrate having a surface with one or more micro-channels having a width of less than 12 μm. A composition is provided over the substrate and in the one or more micro-channels. The composition includes water and silver nanoparticles dispersed in the water and he weight percentage of silver in the composition is greater than 70% and the viscosity of the composition is in a range from 10 to 10,000 centipoise. The composition is removed from the surface of the substrate. The composition provided in the micro-channels is dried and converted to form one or more electrically conductive micro-wires.
Public/Granted literature
- US20140216784A1 MAKING A CONDUCTIVE ARTICLE HAVING MICRO-CHANNELS Public/Granted day:2014-08-07
Information query
