Invention Grant
- Patent Title: Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet
- Patent Title (中): 压敏粘合剂组合物,压敏粘合剂层和压敏粘合片
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Application No.: US13203315Application Date: 2010-02-23
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Publication No.: US09328264B2Publication Date: 2016-05-03
- Inventor: Masato Yamagata , Natsuki Ukei , Junko Nakano
- Applicant: Masato Yamagata , Natsuki Ukei , Junko Nakano
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Knobbe Martens Olson & Bear, LLP
- Priority: JP2009-046672 20090227
- International Application: PCT/JP2010/052754 WO 20100223
- International Announcement: WO2010/098314 WO 20100902
- Main IPC: C09J7/02
- IPC: C09J7/02 ; C09J133/08 ; C09J183/12 ; C08G77/46 ; C08L83/04 ; C08L83/12

Abstract:
Provided is a pressure-sensitive adhesive composition that makes it possible to prevent electrification of a non-antistatic protected material during peeling, is reduced in the risk of staining the protected material, and has good removability, and to provide a pressure-sensitive adhesive layer, a pressure-sensitive adhesive sheet. Specifically provided is a pressure-sensitive adhesive composition which comprises: a (meth)acryl-based polymer including, as a main component, a (meth)acryl-based monomer component having an alkyl group of 1 to 14 carbon atoms; an alkali metal salt; and an organopolysiloxane having a polyoxyalkylene side chain, wherein the (meth)acryl-based polymer has an acid value of 1.0 or less, and the total amount of the alkali metal salt and the organopolysiloxane is from 0.15 to 4 parts by weight, based on 100 parts by weight of the (meth)acryl-based polymer.
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