Invention Grant
- Patent Title: Nano-porous adhesive tie layer
- Patent Title (中): 纳米多孔胶粘层
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Application No.: US13512984Application Date: 2010-11-29
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Publication No.: US09328265B2Publication Date: 2016-05-03
- Inventor: Encai Hao , Kurt C. Melancon , Audrey A. Sherman , William Blake Kolb , Robert F. Kamrath , Maureen A. Kavanagh , Chris J. Tanley , Jeffrey A. Peterson
- Applicant: Encai Hao , Kurt C. Melancon , Audrey A. Sherman , William Blake Kolb , Robert F. Kamrath , Maureen A. Kavanagh , Chris J. Tanley , Jeffrey A. Peterson
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Yen T. Florczak
- International Application: PCT/US2010/058195 WO 20101129
- International Announcement: WO2011/068754 WO 20110609
- Main IPC: B32B3/26
- IPC: B32B3/26 ; C09J7/02 ; C09J133/00 ; C09J175/16 ; C08K3/36
Abstract:
An adhesive tie layer includes a binder including a multifunctional acrylate and a polyurethane, surface treated nanoparticles dispersed in the binder, and a plurality of interconnected voids. A volume fraction of interconnected voids in the adhesive tie layer is not less than about 10%.
Public/Granted literature
- US20120282455A1 NANO-POROUS ADHESIVE TIE LAYER Public/Granted day:2012-11-08
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