The present invention aims to provide a curable composition that is usable in fast curing adhesives and the like and has excellent curability and excellent initial adhesion. The aim is accomplished by use of a curable composition that contains a polyoxyalkylene polymer (a1) having a reactive silyl group (e.g., trimethoxysilyl group) equivalent of 0.15 mmol/g to 1.5 mmol/g and a polyoxyalkylene polymer (a2) having a reactive silyl group equivalent of 0.010 to 0.14 mmol/g. Preferably, the polymers (a1) and (a2) both have a backbone with at least one branch.