An apparatus for securing a component to a substrate. The apparatus includes a backing and a retainer interface. The backing includes a bonding element on a first surface and the retainer interface on an opposing second surface. The first surface of the backing is applied to a substrate to which a component is to be secured. The component is secured on the second surface of the backing so that the backing is positioned between the substrate and the component to be secured. The backing may be rigid or flexible. The first surface of the backing tape includes an adhesive as the bonding element. The backing tape may also include a removable paper interface to enable the installer to move the backing tape into a desired location before removing the paper to expose the adhesive for its attachment to the substrate.