Invention Grant
- Patent Title: Packaged LED module
- Patent Title (中): 封装LED模块
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Application No.: US13817674Application Date: 2011-08-17
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Publication No.: US09328900B2Publication Date: 2016-05-03
- Inventor: Peter Pachler , Janos Dobos , Roland Peinsipp
- Applicant: Peter Pachler , Janos Dobos , Roland Peinsipp
- Applicant Address: AT Jennersdorf AT Dombirn
- Assignee: Tridonic Jennersdorf GmbH,Tridonic GmbH & Co. KG
- Current Assignee: Tridonic Jennersdorf GmbH,Tridonic GmbH & Co. KG
- Current Assignee Address: AT Jennersdorf AT Dombirn
- Agency: The H.T. Than Law Group
- Priority: DE102010039592 20100820; DE102011003608 20110203
- International Application: PCT/EP2011/064136 WO 20110817
- International Announcement: WO2012/022760 WO 20120223
- Main IPC: G02B6/43
- IPC: G02B6/43 ; F21V19/00 ; F21V15/01 ; G02B6/42 ; F21S4/00 ; F21V21/002 ; F21V27/02 ; F21V31/04 ; H01L33/48 ; F21V29/507 ; G09F13/22 ; F21Y101/02

Abstract:
The invention relates to a packaged LED module (1) comprising a module (2) having at least one LED (3) arranged thereon, and a one-piece package (10, 100) having a receptacle for the module (2), a substantially optically transmissive region (11, 11a, 11b, 11c), which makes it possible to emit light from the LED (3) towards the outside, an opening (16) and potting blocking means (17). The package (10, 100) is embodied in such a way that a potting component is introduced via the opening (16) into the package (10, 100) equipped with the module (2). The introduced potting component forms a potting body (30), which completely fills the package (10, 100), excluding a region between the LED (3) and the substantially optically transmissive region (11, 11a, 11b, 11c) on account of the potting blocking means (17), and which connects the package (10, 100), the module (2) and connecting cables (20) that can be connected to the module (2) in an externally sealing manner.
Public/Granted literature
- US20130183779A1 Packaged LED Module Public/Granted day:2013-07-18
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