Invention Grant
- Patent Title: Defect inspection device and defect inspection method
- Patent Title (中): 缺陷检查装置和缺陷检查方法
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Application No.: US14396908Application Date: 2013-04-24
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Publication No.: US09329136B2Publication Date: 2016-05-03
- Inventor: Toshifumi Honda , Yuta Urano , Takahiro Jingu , Akira Hamamatsu
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Baker Botts, LLP
- Priority: JP2012-102819 20120427
- International Application: PCT/JP2013/062139 WO 20130424
- International Announcement: WO2013/161912 WO 20131031
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N21/95 ; G01N21/956 ; G01J1/04

Abstract:
To detect an infinitesimal defect, highly precisely measure the dimensions of the detect, a detect inspection device is configured to comprise: a irradiation unit which irradiate light in a linear region on a surface of a sample; a detection unit which detect light from the linear region; and a signal processing unit which processes a signal obtained by detecting light and detecting a defect. The detection unit includes: an optical assembly which diffuses the light from the sample in one direction and forms an image in a direction orthogonal to the one direction; and a detection assembly having an array sensor in which detection pixels are positioned two-dimensionally, which detects the light diffused in the one direction and imaged in the direction orthogonal to the one direction, adds output signals of each of the detection pixels aligned in the direction in which the light is diffused, and outputs same.
Public/Granted literature
- US20150146200A1 DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD Public/Granted day:2015-05-28
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