An apparatus for determining an electrical reliability of a ball grid array (BGA) assembly of an integrated circuit is presented. The assembly comprises a testing printed circuit board (PCB) having an integrated circuit (IC) test region located thereon. Vias extend through the testing PCB from a surface to an underside thereof within the IC test region. Each via has an IO pad or ground pad electrically connectable thereto. An IC package having an IC die connected thereto by solder bumps is connected to the IC test region by solder balls, such that each of the IO pads is electrically connectable to a respective pair of the solder balls and solder bumps by the vias. A method of testing interconnection reliability of the BGA using the apparatus is also presented.