Invention Grant
- Patent Title: Semiconductor bump-bonded X-ray imaging device
- Patent Title (中): 半导体凸块结合X射线成像装置
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Application No.: US14666344Application Date: 2015-03-24
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Publication No.: US09329284B2Publication Date: 2016-05-03
- Inventor: Konstantinos Spartiotis , Henri Tapio Nykanen , Limin Lin , Tuomas Heikki Elmeri Lahtinen , Pasi Juhani Laukka
- Applicant: OY AJAT LTD.
- Applicant Address: FI Espoo
- Assignee: OY AJAT LTD.
- Current Assignee: OY AJAT LTD.
- Current Assignee Address: FI Espoo
- Agency: Young & Thompson
- Main IPC: G01T1/24
- IPC: G01T1/24 ; H01L31/02 ; H01L27/14 ; H01L27/146 ; H01L31/028
Abstract:
A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.
Public/Granted literature
- US20150279890A1 SEMICONDUCTOR BUMP-BONDED X-RAY IMAGING DEVICE Public/Granted day:2015-10-01
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