Invention Grant
- Patent Title: Electronic device and manufacturing method thereof
- Patent Title (中): 电子装置及其制造方法
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Application No.: US14214401Application Date: 2014-03-14
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Publication No.: US09329420B2Publication Date: 2016-05-03
- Inventor: Shu-hua Dai
- Applicant: Wistron Corp.
- Applicant Address: TW New Taipei
- Assignee: Wistron Corp.
- Current Assignee: Wistron Corp.
- Current Assignee Address: TW New Taipei
- Priority: CN201310513871 20131025
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; F21V8/00
Abstract:
A method for manufacturing an electronic device is provided, including the following steps. First, an outer frame is provided, wherein the outer frame comprises the first frame member and the second frame member. Next, the first frame member is connected to the second frame member by welding to form a connected structure, wherein a welded portion is formed between the first frame member and the second frame member. Then, a punch pin and a punch base are provided. Next, the connected structure is placed on the punch base. Finally, the connected structure is punched by the punch pin.
Public/Granted literature
- US20150116629A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-04-30
Information query
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