Invention Grant
US09329472B2 Method for manufacturing EUV masks minimizing the impact of substrate defects
有权
制造EUV掩模的方法,最大限度地减少衬底缺陷的影响
- Patent Title: Method for manufacturing EUV masks minimizing the impact of substrate defects
- Patent Title (中): 制造EUV掩模的方法,最大限度地减少衬底缺陷的影响
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Application No.: US13970252Application Date: 2013-08-19
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Publication No.: US09329472B2Publication Date: 2016-05-03
- Inventor: Cyril Vannuffel , Jean-Louis Imbert
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Baker & Hostetler LLP
- Priority: FR1257892 20120820
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G03F1/72 ; G03F1/24 ; G06T7/00 ; G03F1/22

Abstract:
In the production of extreme ultraviolet photolithography masks, to produce a set of masks: mask blanks possibly containing defects are provided; an individual map of positions of defects in each mask blank is produced; a concatenated map of defects in a number of masks is produced by transposing, to a given useful zone common to all masks, positions of defects detected during mapping of various mask blanks; individual defect zones each associated with a respective defect and encircling said defect are defined; depending on design rules and on structure to be produced, an electronic version of layouts of the masks is produced, taking account locally, in the design rules, of the existence of each defect in the concatenated map to prevent critical elements from being placed in defect zones; and each mask is produced from any one of the mask blanks and with a respective layout thus obtained.
Public/Granted literature
- US20150024307A1 Method for Manufacturing EUV Masks Minimizing the Impact of Substrate Defects Public/Granted day:2015-01-22
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