Invention Grant
- Patent Title: Photosensitive conductive paste
- Patent Title (中): 感光导电膏
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Application No.: US14374407Application Date: 2013-01-24
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Publication No.: US09329477B2Publication Date: 2016-05-03
- Inventor: Satoshi Matsuba , Tsukuru Mizuguchi , Kazutaka Kusano
- Applicant: Toray Industries, Inc.
- Applicant Address: JP
- Assignee: Toray Industries, Inc.
- Current Assignee: Toray Industries, Inc.
- Current Assignee Address: JP
- Agency: DLA Piper LLP (US)
- Priority: JP2012-013829 20120126; JP2012-073337 20120328
- International Application: PCT/JP2013/051406 WO 20130124
- International Announcement: WO2013/111805 WO 20130801
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G03F7/30 ; G03F7/40 ; H01L21/027 ; H05K3/12 ; H01B1/20 ; G03F7/004 ; H01B1/22 ; C09D5/24 ; H05K1/09 ; G03F7/16 ; H05K3/02
Abstract:
A photosensitive conductive paste provides a coating film having good storage stability, is capable of maintaining high adhesion under relatively low temperature curing conditions, and is also capable of exhibiting high conductivity. The photosensitive conductive paste contains (A) conductive particles, (B) a photosensitie component, (C) a photopolymerization initiator and (D) an epoxy resin, wherein the epoxy resin (D) has an epoxy equivalent weight of 200-500 g/equivalent.
Public/Granted literature
- US20150044610A1 PHOTOSENSITIVE CONDUCTIVE PASTE Public/Granted day:2015-02-12
Information query
IPC分类:
