Invention Grant
- Patent Title: Overlay metrology system and method
- Patent Title (中): 覆盖计量系统和方法
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Application No.: US14084676Application Date: 2013-11-20
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Publication No.: US09329495B2Publication Date: 2016-05-03
- Inventor: Xintuo Dai , Binbin Yan
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Main IPC: G01B11/00
- IPC: G01B11/00 ; G03F7/20

Abstract:
Overlay metrology systems are provided which include, for instance: a first metrology pattern including at least two first pairs of sub-patterns, at least one sub-pattern lacking 90 degree rotational symmetry, and a first center position for the first metrology pattern being determinable in an X-Y coordinate layout from the at least two first pairs of sub-patterns; and a second metrology including at least two second pairs of sub-patterns, at least one sub-pattern lacking 90 degree rotational symmetry, and a second center position for the second metrology pattern being determinable in the X-Y coordinate layout from the at least two second pairs of sub-patterns. Methods of making overlay metrology systems are also provided, which include, for instance, providing a first metrology pattern and a second metrology pattern, and arranging the metrology patterns in relation to each other within the X-Y coordinate layout.
Public/Granted literature
- US20150138555A1 OVERLAY METROLOGY SYSTEM AND METHOD Public/Granted day:2015-05-21
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