Invention Grant
- Patent Title: Apparatus for holding a semiconductor module
- Patent Title (中): 用于保持半导体模块的装置
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Application No.: US14305737Application Date: 2014-06-16
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Publication No.: US09329643B2Publication Date: 2016-05-03
- Inventor: Michael R. Tobias
- Applicant: Michael R. Tobias
- Agency: Vincent Re PLLC
- Main IPC: G06F1/18
- IPC: G06F1/18 ; G06F1/20

Abstract:
A memory module attaches as a component to a printed circuit board. An apparatus is disclosed for securing a memory module to a memory module socket. The apparatus includes a bracket device securely holding the memory module against the memory module socket. The memory module cannot disengage from the memory module socket without first removing the bracket.
Public/Granted literature
- US20140368988A1 APPARATUS FOR HOLDING A SEMICONDUCTOR MODULE Public/Granted day:2014-12-18
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