Invention Grant
- Patent Title: Multiple connector IO board for receiving multiple I/O stream
- Patent Title (中): 用于接收多个I / O流的多连接器IO板
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Application No.: US13931164Application Date: 2013-06-28
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Publication No.: US09330029B1Publication Date: 2016-05-03
- Inventor: Mickey S. Felton
- Applicant: EMC Corporation
- Applicant Address: US MA Hopkinton
- Assignee: EMC Corporation
- Current Assignee: EMC Corporation
- Current Assignee Address: US MA Hopkinton
- Agent Krishnendu Gupta; Konrad R. Lee
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; G06F13/00
Abstract:
An apparatus and system for processing I/O from a data storage chassis, the apparatus and system comprising a first I/O printed circuit board (PCB) including I/O wafers; wherein the I/O wafers of the first I/O PCB are enabled to receive I/O from the data storage chassis; a second I/O PCB including I/O wafers; wherein the I/O wafers of the second I/O PCB are enabled to receive I/O from the data storage chassis; wherein the I/O wafers of the first I/O PCB is constructed and configured to receive the I/O wafers of the second I/O PCB.
Information query
