Invention Grant
- Patent Title: CAD system and method for wireframe coupling
- Patent Title (中): 线框耦合的CAD系统和方法
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Application No.: US12617247Application Date: 2009-11-12
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Publication No.: US09330204B2Publication Date: 2016-05-03
- Inventor: Rami Reuveni
- Applicant: Rami Reuveni
- Applicant Address: US TX Plano
- Assignee: Siemens Product Lifecycle Management Software Inc.
- Current Assignee: Siemens Product Lifecycle Management Software Inc.
- Current Assignee Address: US TX Plano
- Main IPC: G06T17/00
- IPC: G06T17/00 ; G06F17/50 ; G06T19/00

Abstract:
Methods for use in a CAD system. One method includes loading CAD data, the CAD data including a first 2D wireframe geometry and a first 3D feature. The method also includes maintaining a first bi-directional logical relationship between the first 2D wireframe geometry and the first 3D feature and receiving an input of a change to the first 3D feature by the CAD system. The method also includes making the change to the first 3D feature and a corresponding change to the first 2D wireframe geometry by the CAD system using the first bi-directional logical relationship, in response to the input, and storing the changes. CAD systems and computer-readable mediums are also discussed.
Public/Granted literature
- US20100302241A1 CAD SYSTEM AND METHOD FOR WIREFRAME COUPLING Public/Granted day:2010-12-02
Information query
IPC分类:
G | 物理 |
G06 | 计算;推算或计数 |
G06T | 一般的图像数据处理或产生 |
G06T17/00 | 用于计算机制图的3D建模 |