Invention Grant
- Patent Title: Integrated circuit design method
- Patent Title (中): 集成电路设计方法
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Application No.: US14307788Application Date: 2014-06-18
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Publication No.: US09330219B2Publication Date: 2016-05-03
- Inventor: Ching-Shun Yang , Steven Shen , W. R. Lien , Wan-Ru Lin , Chau-Wen Wei
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: G06F7/50
- IPC: G06F7/50 ; G06F17/50
Abstract:
An integrated circuit design method includes extracting a custom IC design parameter from a configuration file using a design customization module (DCM) and creating an IC design file with a module in a processor design kit (PDK) using the custom IC design parameter.
Public/Granted literature
- US20150278419A1 INTEGRATED CIRCUIT DESIGN METHOD Public/Granted day:2015-10-01
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