Invention Grant
- Patent Title: Conductive path structure and wire harness
- Patent Title (中): 导电路径结构和线束
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Application No.: US13819029Application Date: 2011-09-06
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Publication No.: US09330813B2Publication Date: 2016-05-03
- Inventor: Hideomi Adachi , Hidehiko Kuboshima
- Applicant: Hideomi Adachi , Hidehiko Kuboshima
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-198799 20100906
- International Application: PCT/JP2011/070680 WO 20110906
- International Announcement: WO2012/033217 WO 20120315
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01R13/504 ; H01R13/53 ; H01R31/06

Abstract:
A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, a first covering member that covers the first conductive portion and the cut-off facilitating portion, and a second covering member that covers the second conductive portion and the cut-off facilitating portion. The second covering member covers the cut-off facilitating portion through the first covering member. The second covering member slidably covers the first covering member.
Public/Granted literature
- US20130153291A1 CONDUCTIVE PATH STRUCTURE AND WIRE HARNESS Public/Granted day:2013-06-20
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