Invention Grant
- Patent Title: Base metal combination electrode of electronic ceramic component and manufacturing method thereof
- Patent Title (中): 电子陶瓷元件的母金属组合电极及其制造方法
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Application No.: US14017302Application Date: 2013-09-03
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Publication No.: US09330841B2Publication Date: 2016-05-03
- Inventor: Chinglung Tseng
- Applicant: LONGKE ELECTRONICS (HUIYANG) CO., LTD.
- Applicant Address: CN Huizhou
- Assignee: LONGKE ELECTRONICS (HUIYANG) CO., LTD.
- Current Assignee: LONGKE ELECTRONICS (HUIYANG) CO., LTD.
- Current Assignee Address: CN Huizhou
- Priority: CN201310177249 20130514
- Main IPC: H01C7/10
- IPC: H01C7/10 ; H01C7/13 ; H01G4/005 ; H01B1/02 ; C23C4/08 ; H01C1/14 ; H01C17/10 ; H01L41/08 ; H01L41/29 ; H01G4/228 ; H01G4/252 ; H01G4/12

Abstract:
The present invention provides a base metal combination electrode of electronic ceramic component and manufacturing method thereof, wherein said base metal combination electrode comprises a first base metal electrode layer covering on two sides of said electronic ceramic chip and a second base metal electrode layer covering on said first base metal electrode layer, the manufacturing method for base metal combination electrode of electronic ceramic component comprises using thermal spray equipment to spray the electrode material to the surface of electronic ceramic chip. Comparing with using silver paste or copper paste only, it reduces the cost of electrode material without destroying the function of the electrode. The manufacturing method for base metal combination electrode of the present invention has simple technological process, high preparation efficiency and low cost, and it reduces the production cost of electrode of the electronic ceramic component on the whole.
Public/Granted literature
- US20140339955A1 BASE METAL COMBINATION ELECTRODE OF ELECTRONIC CERAMIC COMPONENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-11-20
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