Invention Grant
- Patent Title: Conductive paste for external electrodes and multilayer ceramic electronic component manufactured using the same
- Patent Title (中): 用于外部电极的导电浆料和使用其制造的多层陶瓷电子部件
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Application No.: US14256590Application Date: 2014-04-18
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Publication No.: US09330847B2Publication Date: 2016-05-03
- Inventor: Byung Ho Jun , Jung Wook Seo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0009718 20140127
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01B1/22 ; H01G4/30 ; H01G4/12

Abstract:
A multilayer ceramic electronic component may include: a ceramic body including a plurality of dielectric layers and a plurality of internal electrodes; electrode layers disposed on outer surfaces of the ceramic body to be electrically connected to the internal electrodes and containing a conducive metal and glass; and a conductive resin layer disposed on the electrode layer and containing first copper particles, second copper particles smaller than the first copper particles, copper oxide particles smaller than the second copper particles, and a base resin. The copper oxide particles have a particle size of 20 nm or less.
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