Invention Grant
- Patent Title: Electronic component, electronic-component-embedded substrate, and method for producing electronic component
- Patent Title (中): 电子部件，电子部件嵌入式基板以及电子部件的制造方法
-
Application No.: US13888639Application Date: 2013-05-07
-
Publication No.: US09330848B2Publication Date: 2016-05-03
- Inventor: Yasunori Taseda , Isamu Fujimoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-106818 20120508; JP2013-029913 20130219
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/30 ; H01G4/232 ; H05K1/18
Abstract:
An electronic component includes a body and first and second external electrodes arranged on an external surface of the body. An edge portion of the first external electrode and an edge portion of the second external electrode face each other on the body. The first and second external electrodes each include a copper-metal-containing layer and a protective copper oxide layer covering the copper-metal-containing layer within the edge portion of the first and second external electrodes, respectively.
Public/Granted literature
Information query
