Invention Grant
- Patent Title: Methods of forming line patterns in substrates
- Patent Title (中): 在基板上形成线图案的方法
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Application No.: US14049135Application Date: 2013-10-08
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Publication No.: US09330914B2Publication Date: 2016-05-03
- Inventor: Scott L. Light , Vishal Sipani , Michael D. Hyatt
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John, P.S.
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/033

Abstract:
A method including forming a line pattern in a substrate includes using a plurality of longitudinally spaced projecting features formed along respective guide lines as a template in forming a plurality of directed self-assembled (DSA) lines that individually comprise at least one of (a): the spaced projecting features and DSA material longitudinally there-between, and (b): are laterally between and laterally spaced from immediately adjacent of the guide lines. Substrate material elevationally inward of and laterally between the DSA lines may be processed using the DSA lines as a mask.
Public/Granted literature
- US20150099362A1 Methods of Forming Line Patterns In Substrates Public/Granted day:2015-04-09
Information query
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