Invention Grant
- Patent Title: Passivation layer for workpieces formed from a polymer
- Patent Title (中): 由聚合物形成的工件的钝化层
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Application No.: US13771774Application Date: 2013-02-20
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Publication No.: US09330917B2Publication Date: 2016-05-03
- Inventor: Nicholas Bateman , Deepak Ramappa
- Applicant: Varian Semiconductor Equipment Associates, Inc.
- Applicant Address: US MA Gloucester
- Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee Address: US MA Gloucester
- Main IPC: H01L21/265
- IPC: H01L21/265 ; H01L31/0216 ; H01L31/18

Abstract:
Methods of forming a passivation layer on a workpiece are disclosed. These methods utilize a SiC forming polymer to form the passivation layer. In addition, while the polymer is being heated to form SiC, a second result, such as annealing of the underlying workpiece, or firing of the metal contacts is achieved. For example, the workpiece may be implanted prior to coating it with the polymer. When the workpiece is heated, SiC is formed and the workpiece is annealed. In another embodiment, a workpiece is coating with the SiC forming polymer and metal pattern is applied to the polymer. The firing of workpiece causes the metal contacts to form and also forms SiC on the workpiece.
Public/Granted literature
- US20130224938A1 PASSIVATION LAYER FOR WORKPIECES FORMED FROM A POLYMER Public/Granted day:2013-08-29
Information query
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