Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14626794Application Date: 2015-02-19
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Publication No.: US09330921B2Publication Date: 2016-05-03
- Inventor: Bongkil Kim , Chuanmiao Zhou , Bing Guo , Xiaoyan Zhao
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
- Applicant Address: CN
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee Address: CN
- Agency: Innovation Counsel LLP
- Priority: CN201410133597 20140403
- Main IPC: H01L29/788
- IPC: H01L29/788 ; H01L21/28 ; G11C16/04 ; H01L29/66 ; H01L27/115

Abstract:
A semiconductor device is provided. The semiconductor device includes a semiconductor substrate, and a memory cell disposed on the semiconductor substrate. The memory cell includes a selection transistor and a memory transistor. The selection transistor includes a selection gate, a first source, and a first drain. The memory transistor includes a floating gate, a control gate, a second source, a second drain, and a first insulating layer disposed between the floating gate and the control gate. The semiconductor device further includes a selection gate sidewall spacer disposed near an edge of a bit line of the selection gate of the selection transistor. The selection gate sidewall spacer is separated from the selection gate by a second insulating layer. The selection gate sidewall spacer and the control gate are formed of a first material.
Public/Granted literature
- US20150287731A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-10-08
Information query
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