Invention Grant
- Patent Title: Methods of forming patterns on substrates
- Patent Title (中): 在基材上形成图案的方法
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Application No.: US12467687Application Date: 2009-05-18
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Publication No.: US09330934B2Publication Date: 2016-05-03
- Inventor: Baosuo Zhou , Alex J. Schrinsky
- Applicant: Baosuo Zhou , Alex J. Schrinsky
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L21/033
- IPC: H01L21/033 ; H01L21/311 ; H01L21/3213 ; H01L27/115

Abstract:
Methods of forming a pattern on a substrate include forming carbon-comprising material over a base material, and spaced first features over the carbon-comprising material. Etching is conducted only partially into the carbon-comprising material and spaced second features are formed within the carbon-comprising material which comprise the partially etched carbon-comprising material. Spacers can be formed along sidewalls of the spaced second features. The carbon-comprising material can be etched through to the base material using the spacers as a mask. Spaced third features can be formed which comprise the anisotropically etched spacers and the carbon-comprising material.
Public/Granted literature
- US20100291771A1 Methods Of Forming Patterns On Substrates Public/Granted day:2010-11-18
Information query
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