A method for mounting and embedding a thinned integrated circuit within a substrate is provided. In one embodiment, the thinned integrated circuit can receive one or more biasing substrate layers on a first surface of the thinned integrated circuit. When the thinned integrated circuit is embedded within a supporting substrate, such as a printed circuit board, the biasing substrate layers can position the thinned integrated circuit toward a centerline of the printed circuit board. Positioning the thinned integrated circuit toward the centerline can increase the resistance to breakage.