Invention Grant
US09330946B1 Method and structure of die stacking using pre-applied underfill
有权
使用预应力底层填料的模具堆叠方法和结构
- Patent Title: Method and structure of die stacking using pre-applied underfill
- Patent Title (中): 使用预应力底层填料的模具堆叠方法和结构
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Application No.: US14946904Application Date: 2015-11-20
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Publication No.: US09330946B1Publication Date: 2016-05-03
- Inventor: Mukta G. Farooq , Michael A. Gaynes , Katsuyuki Sakuma
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Jennifer Anda
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/544 ; H01L21/78 ; H01L23/29 ; H01L23/00 ; H01L23/31
Abstract:
Structures and processes for die stacking using an opaque or translucent pre-applied underfill material generally include selectively applying a low surface tension material to at least a portion of an alignment mark surface on a die; and applying the opaque or translucent underfill material to the die surface, wherein the underfill material does not wet or adhere to the low surface tension material such that the alignment mark surface is free of underfill material.
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