Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US12723950Application Date: 2010-03-15
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Publication No.: US09330950B2Publication Date: 2016-05-03
- Inventor: Shinji Wakabayashi
- Applicant: Shinji Wakabayashi
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2009-063954 20090317
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01J37/32

Abstract:
A substrate processing apparatus includes a processing unit performing a predetermined processing on a substrate; a transfer chamber; and a substrate accommodation unit including a substrate accommodation chamber communicating with the transfer chamber via a transfer opening, a gate provided at the transfer opening to separate the substrate accommodation chamber from the transfer chamber, and a gas supply unit supplying a gas into the substrate accommodation chamber. The substrate accommodation chamber accommodates therein substrates that have been processed by the processing unit, and the gas supply unit provides a gas flow suppressing an atmosphere of the transfer chamber from being introduced into the substrate accommodation chamber, thereby preventing undesired reaction between moisture in the atmosphere of the transfer chamber and deposits adhered on the processed substrates accommodated in the substrate accommodation chamber.
Public/Granted literature
- US20100236718A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2010-09-23
Information query
IPC分类: