Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14460081Application Date: 2014-08-14
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Publication No.: US09330981B2Publication Date: 2016-05-03
- Inventor: Shigenobu Maeda , Hyun-pil Noh , Choong-ho Lee , Seog-heon Ham
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello LLP
- Priority: KR10-2011-0124393 20111125
- Main IPC: H01L21/77
- IPC: H01L21/77 ; H01L21/8236 ; H01L21/8234 ; H01L21/8238 ; H01L27/088 ; H01L29/66 ; H01L27/00 ; H01L25/00

Abstract:
Provided are a semiconductor device including a high voltage transistor and a low voltage transistor and a method of manufacturing the same. The semiconductor device includes a semiconductor substrate including a high voltage region and a low voltage region; a high voltage transistor formed in the high voltage region and including a first active region, a first source/drain region, a first gate insulating layer, and a first gate electrode; and a low voltage transistor formed in the low voltage region and including a second active region, a second source/drain region, a second gate insulating layer, and a second gate electrode. The second source/drain region has a smaller thickness than a thickness of the first source/drain region.
Public/Granted literature
- US20140357035A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-12-04
Information query
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