Invention Grant
- Patent Title: System and method for chemical-mechanical planarization of a metal layer
- Patent Title (中): 金属层化学机械平面化的系统和方法
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Application No.: US13631684Application Date: 2012-09-28
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Publication No.: US09330989B2Publication Date: 2016-05-03
- Inventor: Yung-Hsu Wu , Shih-Kang Fu , Hsin-Chieh Yao , Hsiang-Huan Lee , Chung-Ju Lee , Hai-Ching Chen , Shau-Lin Shue
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L21/66 ; H01L21/311 ; H01L21/321 ; H01L21/768

Abstract:
A method for forming a field-effect transistor with a raised drain structure is disclosed. The method includes depositing a low-k inter-metal layer over a semiconductor substrate, depositing a porogen-containing low-k layer over the low-k inter-metal layer, and etching a space for the via through the low-k inter-metal layer and the porogen-containing low-k layer. The method further includes depositing a metal layer, a portion of the metal layer filling the space for the via, another portion of the metal layer being over the porogen-containing low-layer, removing the portion of the metal layer over the porogen-containing layer by a CMP process, and curing the porogen-containing low-k layer to form a cured low-k layer.
Public/Granted literature
- US20140091477A1 SYSTEM AND METHOD FOR CHEMICAL-MECHANICAL PLANARIZATION OF A METAL LAYER Public/Granted day:2014-04-03
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