Invention Grant
US09330992B2 Wiring substrate for a semiconductor device having differential signal paths
有权
具有差分信号路径的半导体器件的布线基板
- Patent Title: Wiring substrate for a semiconductor device having differential signal paths
- Patent Title (中): 具有差分信号路径的半导体器件的布线基板
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Application No.: US14196736Application Date: 2014-03-04
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Publication No.: US09330992B2Publication Date: 2016-05-03
- Inventor: Kazuyuki Nakagawa
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agent Womble Carlyle
- Priority: JP2013-044393 20130306
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/12 ; H01L23/498 ; H01L23/50 ; H05K1/11 ; H01L23/367 ; H05K1/02 ; H01L23/00
Abstract:
A semiconductor device is provided with improved resistance to noise. Conductive planes are respectively formed over wiring layers. One wiring layer is provided with a through hole land integrally formed with a through hole wiring. In other wiring layers located over the wiring layer with the through hole land, openings are respectively formed in the conductive planes. The area of each of the openings is larger than the plane area of the through hole land.
Public/Granted literature
- US20140252612A1 WIRING SUBSTRATE FOR A SEMICONDUCTOR DEVICE HAVING DIFFERENTIAL SIGNAL PATHS Public/Granted day:2014-09-11
Information query
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