Invention Grant
US09330993B2 Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
有权
促进底层填充物与导电性凸起之间的粘附的方法以及由此形成的结构
- Patent Title: Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
- Patent Title (中): 促进底层填充物与导电性凸起之间的粘附的方法以及由此形成的结构
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Application No.: US13721266Application Date: 2012-12-20
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Publication No.: US09330993B2Publication Date: 2016-05-03
- Inventor: Yiqun Bai , Yuying Wei , Arjun Krishnan , Suriyakala Ramalingam , Yonghao Xiu , Beverly J. Canham , Sivakumar Nagarajan , Saikumar Jayaraman , Nisha Ananthakrishnan
- Applicant: Yiqun Bai , Yuying Wei , Arjun Krishnan , Suriyakala Ramalingam , Yonghao Xiu , Beverly J. Canham , Sivakumar Nagarajan , Saikumar Jayaraman , Nisha Ananthakrishnan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/29 ; H01L21/56
Abstract:
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.
Public/Granted literature
- US20140175634A1 METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMPS AND STRUCTURES FORMED THEREBY Public/Granted day:2014-06-26
Information query
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