Invention Grant
- Patent Title: Heat management in electronics packaging
- Patent Title (中): 电子封装热管理
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Application No.: US14677601Application Date: 2015-04-02
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Publication No.: US09331000B2Publication Date: 2016-05-03
- Inventor: Mark Eblen , Franklin Kim , Chong Il-Park , Shinichi Hira
- Applicant: Kyocera America Inc
- Applicant Address: US CA San Diego
- Assignee: Kyocera America, Inc.
- Current Assignee: Kyocera America, Inc.
- Current Assignee Address: US CA San Diego
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/495 ; H01L23/367 ; H01L21/48 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L23/047 ; H01L23/36 ; H01L21/50 ; H01L23/373
Abstract:
An electronics packaging system includes an insulator that electrically insulates a heat sink from electrical leads. An interface between the insulator and the heat sink includes a stress reliever constructed such that a stiffness of the interface is greater than the stiffness of the interface without the stress reliever.
Public/Granted literature
- US20150287661A1 HEAT MANAGEMENT IN ELECTRONICS PACKAGING Public/Granted day:2015-10-08
Information query
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