Invention Grant
US09331003B1 Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof
有权
具有预成型引线框的集成电路封装系统及其制造方法
- Patent Title: Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof
- Patent Title (中): 具有预成型引线框的集成电路封装系统及其制造方法
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Application No.: US14229538Application Date: 2014-03-28
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Publication No.: US09331003B1Publication Date: 2016-05-03
- Inventor: Zigmund Ramirez Camacho , Bartholomew Liao Chung Foh , Sheila Marie L. Alvarez , Dao Nguyen Phu Cuong , HeeJo Chi
- Applicant: Zigmund Ramirez Camacho , Bartholomew Liao Chung Foh , Sheila Marie L. Alvarez , Dao Nguyen Phu Cuong , HeeJo Chi
- Applicant Address: SG Singapore
- Assignee: STATS ChipPac Ltd.
- Current Assignee: STATS ChipPac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L23/495 ; H01L23/31 ; H01L21/48
Abstract:
An integrated circuit packaging system, and method of manufacture thereof, includes: lead islands; a pre-molded material surrounding a bottom of the lead islands; a device over a portion of the lead islands and having electrical connections to another portion of the lead islands, the electrical connections over areas of the another portion of the lead islands over areas covered by the pre-molded material; and an encapsulation over the device and the lead islands.
Information query
IPC分类:
