Invention Grant
- Patent Title: System support for electronic components and method for production thereof
- Patent Title (中): 电子元件的系统支持及其生产方法
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Application No.: US12996738Application Date: 2009-06-03
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Publication No.: US09331010B2Publication Date: 2016-05-03
- Inventor: Wolfgang Pahl , Karl Weidner
- Applicant: Wolfgang Pahl , Karl Weidner
- Applicant Address: DE Munich
- Assignee: Epcos AG
- Current Assignee: Epcos AG
- Current Assignee Address: DE Munich
- Agency: Nixon Peabody LLP
- Priority: DE102008028299 20080613
- International Application: PCT/EP2009/056832 WO 20090603
- International Announcement: WO2009/150087 WO 20091217
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/498 ; B81B7/00 ; H01L23/00 ; H01L23/538
Abstract:
A chip (2, 3) is arranged above a top side of a flexible support (1) and mechanically decoupled from the support. Electrical connections (8, 11) of the chip are embodied using a planar connection technique. The chip can be separated from the support by an air gap or a base layer (7) composed of a soft or compressible material.
Public/Granted literature
- US20110133315A1 SYSTEM SUPPORT FOR ELECTRONIC COMPONENTS AND METHOD FOR PRODUCTION THEREOF Public/Granted day:2011-06-09
Information query
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