Invention Grant
- Patent Title: Electronic interconnects and devices with topological surface states and methods for fabricating same
- Patent Title (中): 具有拓扑表面状态的电子互连和器件及其制造方法
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Application No.: US13039762Application Date: 2011-03-03
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Publication No.: US09331020B2Publication Date: 2016-05-03
- Inventor: Ali Yazdani , N. Phuan Ong , Robert J. Cava
- Applicant: Ali Yazdani , N. Phuan Ong , Robert J. Cava
- Agency: Meagher Emanuel Laks Goldberg & Liao, LLP.
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L23/532 ; H01L29/786 ; H01L21/768 ; C22C28/00 ; C22C30/00 ; H01L29/78
Abstract:
An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.
Public/Granted literature
- US20120161209A1 ELECTRONIC INTERCONNECTS AND DEVICES WITH TOPOLOGICAL SURFACE STATES AND METHODS FOR FABRICATING SAME Public/Granted day:2012-06-28
Information query
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