Invention Grant
- Patent Title: Method of manufacturing a nonvolatile memory device
- Patent Title (中): 非易失性存储器件的制造方法
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Application No.: US14530988Application Date: 2014-11-03
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Publication No.: US09331087B2Publication Date: 2016-05-03
- Inventor: Jong Soon Leem
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-Si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-Si
- Agency: Marshall, Gerstein & Borun LLP
- Priority: KR10-2009-0050439 20090608
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L21/28

Abstract:
A method of manufacturing a nonvolatile memory device comprises forming a gate insulating layer and a first conductive layer over a semiconductor substrate that defines a first area in which selection lines will be formed and a second area in which word lines will be formed, performing an etch process to lower a height of the first conductive layer in the first area, forming a dielectric layer and a second conductive layer over the first conductive layer with a height that is different from the height of the first conductive layer, and performing a gate patterning process to form the selection lines and the word lines.
Public/Granted literature
- US20150050802A1 METHOD OF MANUFACTURING A NONVOLATILE MEMORY DEVICE Public/Granted day:2015-02-19
Information query
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