Invention Grant
US09331090B2 Compact three dimensional vertical NAND and method of making thereof
有权
紧凑型三维垂直NAND及其制作方法
- Patent Title: Compact three dimensional vertical NAND and method of making thereof
- Patent Title (中): 紧凑型三维垂直NAND及其制作方法
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Application No.: US14517122Application Date: 2014-10-17
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Publication No.: US09331090B2Publication Date: 2016-05-03
- Inventor: Johann Alsmeier , Raghuveer S. Makala , Xiying Costa , Yanli Zhang
- Applicant: SANDISK TECHNOLOGIES INC.
- Applicant Address: US TX Plano
- Assignee: SANDISK TECHNOLOGIES INC.
- Current Assignee: SANDISK TECHNOLOGIES INC.
- Current Assignee Address: US TX Plano
- Agency: The Marbury Law Group PLLC
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L27/115 ; H01L29/788 ; H01L29/66 ; G11C16/04 ; H01L21/764 ; H01L29/792

Abstract:
A NAND device has at least a 3×3 array of vertical NAND strings in which the control gate electrodes are continuous in the array and do not have an air gap or a dielectric filled trench in the array. The NAND device is formed by first forming a lower select gate level having separated lower select gates, then forming plural memory device levels containing a plurality of NAND string portions, and then forming an upper select gate level over the memory device levels having separated upper select gates.
Public/Granted literature
- US20150037950A1 COMPACT THREE DIMENSIONAL VERTICAL NAND AND METHOD OF MAKING THEREOF Public/Granted day:2015-02-05
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