Invention Grant
US09331116B2 Back side illuminated single photon avalanche diode imaging sensor with high short wavelength detection efficiency
有权
具有高短波长检测效率的背面照明单光子雪崩二极管成像传感器
- Patent Title: Back side illuminated single photon avalanche diode imaging sensor with high short wavelength detection efficiency
- Patent Title (中): 具有高短波长检测效率的背面照明单光子雪崩二极管成像传感器
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Application No.: US14156053Application Date: 2014-01-15
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Publication No.: US09331116B2Publication Date: 2016-05-03
- Inventor: Eric A. G. Webster
- Applicant: OMNIVISION TECHNOLOGIES, INC.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A single photon avalanche diode (SPAD) includes an n doped epitaxial layer disposed in a first semiconductor layer. A p doped epitaxial layer is above the n doped epitaxial layer on a back side of the first semiconductor layer. A multiplication junction is defined at an interface between the n doped epitaxial layer and the p doped epitaxial layer. A multiplication junction is reversed biased above a breakdown voltage such that a photon received through the back side of the first semiconductor layer triggers an avalanche multiplication process in the multiplication junction. A p− doped guard ring region is implanted in the n doped epitaxial layer surrounding the multiplication junction.
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