Invention Grant
- Patent Title: Solid-state imaging device with varied impurity concentration, method for manufacturing a solid-state imaging device, and camera module including a solid-state imaging device
- Patent Title (中): 具有不同杂质浓度的固态成像装置,制造固态成像装置的方法和包括固态成像装置的相机模块
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Application No.: US14161051Application Date: 2014-01-22
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Publication No.: US09331122B2Publication Date: 2016-05-03
- Inventor: Motohiro Maeda , Nagataka Tanaka
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P
- Priority: JP2013-164362 20130807
- Main IPC: H04N3/14
- IPC: H04N3/14 ; H01L27/148 ; H01L27/146

Abstract:
According to one embodiment of the present invention, a solid-state imaging device is provided. The solid-state imaging device includes a first-conductivity-type semiconductor region and a second-conductivity-type semiconductor region. The first-conductivity-type semiconductor region is disposed for each pixel of a captured image. The second-conductivity-type semiconductor region constitutes a photoelectric conversion element by a PN junction with the first-conductivity-type semiconductor region, and has second-conductivity-type impurity concentration that decreases from the center of the photoelectric conversion element toward a transfer gate side for transferring signal charge.
Public/Granted literature
- US20150042854A1 SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, AND CAMERA MODULE Public/Granted day:2015-02-12
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