Invention Grant
US09331143B1 Semiconductor structure having field plates over resurf regions in semiconductor substrate
有权
半导体结构在半导体衬底中的覆盖区域上具有场板
- Patent Title: Semiconductor structure having field plates over resurf regions in semiconductor substrate
- Patent Title (中): 半导体结构在半导体衬底中的覆盖区域上具有场板
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Application No.: US14548319Application Date: 2014-11-20
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Publication No.: US09331143B1Publication Date: 2016-05-03
- Inventor: Ying-Chieh Tsai , Wing-Chor Chan , Shyi-Yuan Wu , Jeng Gong
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/739

Abstract:
A semiconductor structure is provided. The semiconductor structure comprises: a substrate; a first doping region, a first well and a second doping region formed in the substrate; a plurality of first heavily doped regions formed in the first doping region; a plurality of conductors and a plurality of dielectrics formed on the substrate between the first heavily doped regions; a second heavily doped region formed in the first well; a third heavily doped region and a fourth heavily doped region formed in the second doping region; as well as a first gate electrode and a first gate dielectric. The first doping region, the first well, the second heavily doped region and the fourth heavily doped region have a first type of doping. The second doping region, the first heavily doped regions and the third heavily doped region have a second type of doping.
Public/Granted literature
- US20160148994A1 SEMICONDUCTOR STRUCTURE HAVING FIELD PLATES OVER RESURF REGIONS IN SEMICONDUCTOR SUBSTRATE Public/Granted day:2016-05-26
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