- Patent Title: Compound semiconductor device and method of manufacturing the same
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Application No.: US13718823Application Date: 2012-12-18
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Publication No.: US09331190B2Publication Date: 2016-05-03
- Inventor: Masahito Kanamura , Toshihide Kikkawa
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2009-230877 20091002
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/778 ; H01L29/20

Abstract:
An intermediate layer composed of i-AlN is formed between a channel layer and an electron donor layer, a first opening is formed in an electron donor layer, at a position where a gate electrode will be formed later, while using an intermediate layer as an etching stopper, a second opening is formed in the intermediate layer so as to be positionally aligned with the first opening, by wet etching using a hot phosphoric acid solution, and a gate electrode is formed so that the lower portion thereof fill the first and second openings while placing a gate insulating film in between, and so that the head portion thereof projects above the cap structure.
Public/Granted literature
- US20130105862A1 COMPOUND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-05-02
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